Thermal silica films, LED insulating silica films, silicone heat sink fixtures, soft silicone pads, United Tenda thermal silica http://www.LTDLV.com, contact Lin cord-like test. Overview LC LC thermal silica films thermal silica film is a high-performance thermally conductive gap filling materials, mainly for passing interface electronic devices and the heat sink or the case between. LC thermal silica film has good adhesion, flexibility, good compression performance and excellent thermal conductivity. So that it can fully make use of electronic originals and the air discharge between the heat sink in order to achieve full contact, significantly increase the cooling effect. LC thermal silica film has a slightly viscous than conventional thermal insulation materials bring great convenience during installation of the product, easy off, easy to operate. Features Benefits compressibility strong, soft and elastic high thermal conductivity of both natural viscosity, without additional surface between the amount of adhesive to meet the environmental requirements of ROHS and UL applications populate the IC and heat sink or the case is between the board and the heat sink of the Typical applications for communications equipment fill filling cooling IC and similar materials (such as metal shield) between the computer switching power supply flat-screen TV mobile video device networking products household appliances PC server / workstation CD-ROM / COMBO laptop base station to put more information, please visit http://www.ltdlv.com/pro-249_675.html.