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| No.13758624
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Information Name: | Thermal conductivity potting | Power sealants | Silicone encapsulants |
Published: | 2015-05-27 |
Validity: | 30 |
Specifications: | 1: 1-component potting |
Quantity: | 10000.00 |
Price Description: | |
Detailed Product Description: | Thermal conductivity potting | Power sealants | Silicone encapsulants thermal conductivity potting flame retardant is a low viscosity two-component addition silicone thermal conductivity potting, room temperature curing can also be heat cured, has a temperature of more High faster the cure characteristics. The goods in the curing reaction does not produce any by-products can be applied to the surface PC (Poly-carbonate), PP, ABS, PVC, etc. and metal class. Apply to electronic accessories thermal conductivity, insulation, waterproof and flame retardant, flame retardancy can reach UL94-V0 level. Full compliance with EU ROHS directive. Thermal conductivity potting Features: good thermal conductivity and flame resistance, low viscosity, good leveling, cured to form soft rubber-like, impact resistance, heat resistance, moisture resistance, cold resistance, insulation, moisture, shock, corona resistant, anti-leakage and chemical resistance properties, strong adhesion. Thermal conductivity potting applications: power modules, electronic components potting deep, especially for HID power module encapsulants, potting mechanical stick outdoor LED display, TV, CRT, power supply, communications equipment, and other electrical and electronic components then sealing electronic components and adhesively fixed, other organic flame retardant metal, plastic, glass and other adhesive seal. Note: The above performance data are at 25 ℃, relative humidity of 55% cure measured after 1 day. The company's test conditions caused by different or product improvement data different will not take the responsibility. Product Features 1,? LTD315 plus molding encapsulants excellent thermal conductivity, thermal conductivity up to 0.8W / mk, while good flowability 2,? LTD315 plus molding encapsulants RTV, heating can significantly improve the cure rate, after curing elastic rubber body 3,? LTD315 plus molding encapsulants good flame retardant 4,? LTD315 plus molding encapsulants non-corrosive to metal? Typical applications 1,? LTD315 plus molding encapsulants suitable for encapsulation, potting or sealing 2 ?, LTD315 plus molding encapsulants suitable for protecting electronic components, assemblies 3, LTD315 plus molding encapsulants for power module, a variety of communication modules, micro-transformer package use 1, weighing:?? according to 1 : 1 weight ratio weighing A, B component. 2, mixed: the two parts of rubber mix thoroughly, preferably using a dedicated rubber mixing equipment (such as a small planetary mixer). Note scraping bottom and sides mixed container wall when manual mixing. 3, degassing: vacuum degassing in special rubber mixing equipment. It can also be mixed together with a good rubber compounding vessel was placed in a vacuum discharge bulbs apparatus, pumping vacuum degassing process. Vacuum row bubble process, the liquid mixture may rise to 3 to 4 times the surface position of the original volume, and then automatically break the bubble collapse. Maintain the vacuum after breaking bubble of 4 to 6 minutes, then release the vacuum. 4. Glue: The glue with a good potting material poured into the needs of the site. It was allowed to stand at room temperature, the vulcanization of natural and to be heated to accelerate curing. 1 compatibility, specific materials, compounds, curing agents and plasticizers can inhibit the? LTD315 cure. ? The main ingredients include an organic tin and other organometallic compound 2, containing tin catalyst silicone rubber 3, sulfur, polysulfides, polysulfones or other sulfur-containing materials? 4, amine, urethane or containing amine article 5, unsaturated hydrocarbon plasticizers 6, some of the flux residue?? packaging, storage and transportation 1,? LTD315 plus molding encapsulants points A, B groups were using large mouth plastic barrels packaged separately. Packing 2 * 10Kg. 2,? LTD315 plus molding encapsulants during storage and transport, should be stored in a cool dry place, avoid the sun and rain. A / B stored at between 0 ℃ ~ 30 ℃, under the original unopened shelf life of six months or more. 3, the storage period exceeds the shelf life does not mean that this product is completely unavailable. In this case, the relative performance quality testing should be done to ensure its quality. 4, rubber non-dangerous goods transport. ? Notes 1,? A component LTD315 add molding encapsulants and B component contained ingredients has been proven after years of non-toxic, without special precautions, which require the use of only the general industrial hygiene care standards. 2, as the product vulnerable to poisoning and loss of catalyst activity, heavy metal compounds should contact materials containing nitrogen, phosphorus, sulfur and organic tin compounds like to avoid, and keep utensils clean. 3, ambient temperature right? Operating pot LTD315 mixed to some extent. Suitable for high ambient temperature operation period has been shortened. |
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Copyright © GuangDong ICP No. 10089450, Shenzhen Tenda Technology Co., Ltd. All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
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You are the 14438 visitor
Copyright © GuangDong ICP No. 10089450, Shenzhen Tenda Technology Co., Ltd. All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
AllSources Network's Disclaimer: The legitimacy of the enterprise information does not undertake any guarantee responsibility