Heat ceramics, electronic heat sinks, silicon carbide ceramics, ceramic heat sink interference, high-end heat sink factory direct. Ceramic heat-chip features a superior thermal performance due to the surface area of ??the relationship between the structure of micro holes, a ceramic metal radiator fins compared to a surplus of about 20% of the pores, thus air convection medium has a larger contact area, it is possible the same unit of time away more heat, heat sink bonded silicon carbide ceramic material 8.8 times stronger than the metal of the heat radiation characteristics (Table II) initiative far exceeds the thermal performance of passive cooling only metallic materials. As shown in Table 1 below, silicon carbide (sic) the absorption of heat capacity and a relatively high compared to aluminum, and copper compared to the relatively low number. Ceramic heat insulation performance chip features two virtually almost non-conductive silicon carbide itself is a good insulator, other metal materials do not have fins. Insulated metal material to do, then, must be to a surface oxidation treatment, etc., on the one hand increases the cost, and work, but also reduce the thermal conductivity, comprehensive consideration of the ceramic heat sink is the most suitable insulating heat sink. Ceramic heat-chip features three isolated absorb electromagnetic properties of silicon carbide ceramic sheets of itself does not produce electromagnetic waves, electromagnetic waves can be isolated, may also absorb some of the electromagnetic wave, electromagnetic wave aspect to consider is the best choice of cooling products. Metal material properties of the metal fins because, inevitably produce electromagnetic waves, which is a major feature of metal material silicon carbide heat sink fins compared to ceramic. Ceramic heat-chip features four anti-corrosion, anti-oxidation, anti-thermal shock, low thermal expansion coefficient corrosion, anti-oxidation, anti-thermal shock, low thermal expansion coefficient of silicon carbide material which is widely used primary function is different from the metal material and corrosive easily oxidized, easily affected by changes in temperature and thermal expansion and contraction, leading off stickers, fixation instability and reduce thermal performance and other issues, a silicon carbide ceramic heat sink in anti-corrosion, anti-oxidation, anti-thermal shock in these areas It has a clear advantage, while maintaining a stable external morphology in high temperature environment to maintain a stable thermal performance is the best choice for harsh thermal environments. Ceramic heat-chip features just before dawn because the ceramic thin cooling fins select special micro pores of the structure, as well as tight as 1.95g / cm3 density, the ceramic heat sink material is thinner and lighter than other fins, this feature makes thin Ceramic cooling fins to be the best choice of electronic products that require higher design space and cooling requirements.