High thermal silica films, silica films, high thermal conductivity, thermal pads Shenzhen Tenda Technology ww w.LTDLV.com, contact Linsheng 136 0041 1602, QQ 8757 93 380 cord-like test. Overview LC LC thermal silica films thermal silica film is a high-performance thermally conductive gap filling materials, mainly for passing interface electronic devices and the heat sink or the case between. LC thermal silica film has good adhesion, flexibility, good compression performance and excellent thermal conductivity. So that it can fully make use of electronic originals and the air discharge between the heat sink in order to achieve full contact, significantly increase the cooling effect. LC thermal silica film has a slightly viscous than conventional thermal insulation materials bring great convenience during installation of the product, easy off, easy to operate. Features Benefits compressibility strong, soft and elastic high thermal conductivity of both natural viscosity, without additional surface between the amount of adhesive to meet the environmental requirements of ROHS and UL applications populate the IC and heat sink or the case is between the board and the heat sink of the Typical applications for communications equipment, computers filled switching power supply flat-screen TV mobile video device network PC server products household appliances and similar filling IC heat sink material (such as metal shield) between / workstation CD-ROM / COMBO laptop base station put basic specifications: 200 * 400MM, width up to 400mm, any length. The thickness of the thinnest of up to 0.3mm, using a standard cut to specific dimensions to follow.